The EEMI 450 project is the first time that all major European E&M companies, together with the dominating institutes in this field and partners in the supply chain are cooperating in a really broad joint effort. Completely new approaches will be addressed. Wafer-handling platforms will be considered separately and the outcome of research will be transferred into optimal concepts and configurations. R&D concerning material aspects of 450mm wafers will play a major role and wafers out of this effort will be made available to the other partners. From the equipment side, the project will address initial efforts to come to different process modules for oxidation, deposition, lithography and etch. Wafer-bonding equipment will be developed for SOI. Metrology will be focused on the specific topics as mentioned above.| eniac.eu/web/downloads/projectprofiles/call2_eniac_eemi450.pdf|